Meta-Study on Integrated Cooling of Modern Integrated Circuits using Microfluidics

Active Microfluidic Cooling of Integrated Circuits

The thermal management of high heat fluxes is a critical roadblock in the way of higher-performance microelectronics. The ongoing reduction in microtransistor size translates into heat fluxes comparable to those encountered in nuclear reactions and rocket nozzles, but under much severer temperature constraints. Although the average heat flux may remain in the vicinity of 100 to 300 W/cm, the pe...

Pneumatic oscillator circuits for timing and control of integrated microfluidics.

Frequency references are fundamental to most digital systems, providing the basis for process synchronization, timing of outputs, and waveform synthesis. Recently, there has been growing interest in digital logic systems that are constructed out of microfluidics rather than electronics, as a possible means toward fully integrated laboratory-on-a-chip systems that do not require any external con...

Using Photonic Integrated Circuits

Contention resolution and forwarding of labeled optical packets at 40 Gb/s is demonstrated utilizing multiple InP based optical buffers and monolithic wavelength converters. Layer-2 packet recovery measurements are presented. ©2009 Optical Society of America OCIS codes: (060.1810) Buffers, couplers, routers, switches, and multiplexers; (060.6719) Switching, packet

Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits

In an effort to increase processor speeds, 3D IC architecture is being aggressively pursued by researchers and chip manufacturers. This architecture allows extremely high level of integration with enhanced electrical performance and expanded functionality, and facilitates realization of VLSI and ULSI technologies. However, utilizing the third dimension to provide additional device layers poses ...

Integrated Circuits